【講座題目】Micro and Miniature Technologies for Advanced Passive Energy Systems (fuel cells and heat pipes)

【講座時(shí)間】2017年8月21日（周一）14:00-15:00

【講座地點(diǎn)】教四C211

【主 講 人】Faghri Amir

【主講人簡介】

Dr. Faghri is currently Distinguished Professor of Engineering and Distinguished Dean Emeritus of Engineering at the University of Connecticut. Dr. Faghri has authored four books, more than 350 archival technical publications (including over 230 journal papers), and thirteen U.S. patents. Dr. Faghri has served as a principal investigator conducting research in the area of thermal management and multiphase transport phenomena for applications ranging from advanced cooling systems to alternative energy systems, including heat pipes, fuel cells, solar energy systems and thermal energy storage devices. Dr. Faghri has received many honors and awards, including the American Institute of Aeronautics & Astronautics (AIAA) Thermophysics Award in 1998, the American Society of Mechanical Engineering (ASME) Heat Transfer Memorial Award in 1998, the ASME James Harry Potter Gold Medal In 2005, and the ASME/AIChE Max Jakob Memorial Award in 2010, which is the highest honor in the field of heat transfer. 

【內(nèi)容簡介】

The 21^st century will see the development of a wide range of active miniaturized energy devices with application in energy management and power sources, electronic cooling, energy storage and bioengineering. Although these active devices are effective, they are often cumbersome and inefficient considering the auxiliary supporting devices such as pumps, fans, and other moving parts they require for operation. A more efficient and novel approach involves the use of passive small energy and thermal devices with no moving parts. Two research thrusts are passive fuel cells and heat pipes which are discussed. A Miniature passive direct methanol fuel cell (DMFC) that includes a fuel cell stack and ancillary systems with no moving parts will be presented. The performance characteristics of the passive miniature DMFC system will be presented. Increasing component densities of the integrated circuit (IC) and packaging level, as well as energy conservation requirements have led to serious challenges in thermal management.  Innovative heat pipes and thermosyphons are some of the most promising passive thermal devices because of their high efficiency, reliability and cost -effectiveness.  Challenges and opportunities of these devices will be discussed.